Samsung announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that ...

Explore the history and evolution of puzzle cubes leading up to the iconic Rubik's Cube in this video. It features 3D animation to illustrate key developments in this fascinating journey. #rubikscube ...

SEOUL, Korea--(BUSINESS WIRE)--Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest ...

'H-Cube' applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit SEOUL, Korea -- November 11, 2021-- ...