SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence ® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.
SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...
The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands State-of-the-art topside cooling (GTPAK™) and gull-wing ...
A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...
Alpha and Omega Semiconductor Ltd. (AOS) has introduced two advanced surface-mount package options for its high power MOSFET portfolio. Designed to meet the packaging requirements for the most ...
In the realm of Linux distributions, Debian stands out for its stability, security, and rich repository of software packages. Managing these packages efficiently is fundamental to maintaining system ...
Debian-based Linux distributions, such as Ubuntu, Linux Mint, and Debian itself, rely on robust package management systems to install, update, and remove software efficiently. One of the most critical ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results