TOKYO--(BUSINESS WIRE)--Toshiba Corporation (TOKYO:6502) announced today that the launch of "CIPS183BS210", a Contact Image-Sensor Module with a faster data rate, for application in banknote ...
WATERLOO, Canada, July 09, 2024 (GLOBE NEWSWIRE) -- Teledyne DALSA is pleased to announce that its AxCIS™ family of high-speed and high-resolution fully integrated line scan imaging modules are now ...
WATERLOO, Ontario, Sept. 27, 2022 (GLOBE NEWSWIRE) -- Teledyne DALSA is pleased to introduce AxCIS™, a new family of high-speed and high-resolution fully integrated line scan imaging modules. These ...
CMOS image sensors, originally developed for conventional photography, have evolved into versatile detectors capable of monitoring various forms of radiation. Their compact design, low power ...
WATERLOO, Ontario, Nov. 30, 2023 (GLOBE NEWSWIRE) -- Teledyne DALSA is pleased to announce that its AxCIS™ family of high-speed and high-resolution fully integrated line scan imaging modules are in ...
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced a major update to its high-performance, low-power ...
The global sensors market is rapidly evolving, combining established technologies like MEMS, pressure and image sensors with emerging innovations such as quantum sensors, silicon photonics, and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback