Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...
Comparison of Class I and Class II MLCCs. The importance of equivalent series resistance. Why Class I caps are the choice when meeting power-density requirements. Two primary characteristics of a ...
Small standalone and embedded systems — think garage door openers, electric drills, manufacturing line equipment, and medical analysis systems — typically contain an 8-bit or 16-bit microcontroller ...
Efficient Power Conversion (EPC) introduces the 150 V, 6 mΩ EPC2308 GaN FET, offering higher performance and smaller solution size for high power density applications including DC-DC conversion, AC/DC ...
Schaumburg, Ill. — Omron Electronic Components LLC has introduced the G5T series of slim power PCB relays in a 7.0 x 20.4 x 15.0-mm (WxLxH) footprint, making them suitable for high-density ...
TINLEY PARK, Ill.--(BUSINESS WIRE)--Panduit Corp., the leading global provider of small diameter 28-AWG cabling solutions, has added UTP and Shielded Category 6A performance patch cords to its 28-AWG ...
New portfolio caters to high-density applications and AI workloads, providing improved weight support, cooling capacity, and connectivity. Enhanced features include the second generation of NetShelter ...
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