An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with investment estimated ...
Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a ...
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