Semiconductor Engineering

Module Testing Adds New Challenges

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
EDN

Combine in-circuit and functional component test advantages

Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...
PV Tech

Beyond IEC 61215-2: rethinking mechanical testing for tracker mounted PV modules

Arthur Cao outlines how fresh approaches are needed to ensure tracker-based PV systems are designed adequately to avoid ...
EDN

Combining functional and in-circuit test

CheckSum’s Analyst ems+ft system combines in-circuit test (ICT) and functional test to target OEMs and contract manufacturers building power supplies, automotive electronics, medical electronics, ...
Johns Hopkins University Applied Physics Laboratory

Dragonfly Mission Begins Rotorcraft Integration, Testing Stage

Integration and testing — the activities involved in assembling the Dragonfly rotorcraft lander and testing it for the rigors ...
Electronic Design

Functional Testing and Validation for DDR4 and LPDDR4

Representing the most recent generation of double-data-rate (DDR) SDRAM memory, DDR4 and low-power LPDDR4 together provide improvements in speed, density, and power over DDR3. However, such speed and ...