Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X, are critical infrastructure for one of Intel’s quietly fast-growing businesses: advanced chip packaging.

This is exactly the kind of anchor customer the Intel Foundry business has been trying to land since Pat Gelsinger first pitched IDM 2.0.

Advanced packaging has quietly become the make-or-break factor in the AI race. Hyperscalers need to combine chiplets, high-bandwidth memory, and dense interconnects into powerful final packages that overcome the physical limits of printing ever-larger chips on a single wafer.

Intel Corp. is joining Elon Musk’s long-shot effort to develop semiconductors for Tesla Inc., SpaceX and xAI, marking a surprising twist in the chipmaker’s comeback bid.

TL;DR: Intel's new Fab 52 in Chandler, Arizona, produces the most advanced US-made logic chips using the cutting-edge 18A process node, featuring RibbonFET and PowerVia innovations. This facility is part of Intel's $100 billion investment to expand ...

Intel's (NASDAQ: INTC) foundry strategy until recently could be summed up as "if you build it, they will come." The company poured capital into manufacturing facilities and raced to bring new manufacturing processes into production. The Intel 18A process ...

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. Intel came to its annual Tech Tour last week not to tease incremental updates, but to draw a line in the silicon ...

Well, now this is unexpected. Analyst Ming-Chi Kuo has just revealed that Intel is expected to begin shipping Apple's M-series processors in 2027. This would mark a huge comeback of the partnership between the two companies, which Apple started to move ...