NewPhotonics® Ltd., the award-winning fabless semiconductor designer delivering innovative all-optical domain connectivity solutions for data center interconnect, today introduced NPC50503 1.6T NPO ...
Enterprises pursuing digital transformation drive demand for robust data center interconnect platforms, focusing on secure, scalable connectivity. Key opportunities lie in integrating hybrid cloud and ...
New silicon photonics and next-gen BiCMOS proprietary technologies bring better performance to address the coming 800Gb/s and 1.6Tb/s optical interconnects. Developing a roadmap with partners across ...
DUBLIN--(BUSINESS WIRE)--The "Optical Interconnect Market by Product Category (Cable Assemblies, Connectors, Optical Transceivers), Interconnect Level, Fiber Mode, Data Rate, Distance, Application ...
Santa Barbara-based Lucidean, a deep-tech startup working at the cutting edge of optical interconnect technologies, has ...
Nashua, N.H. — Teradyne Inc.'s Connection Systems Division (TCS) announced the company's first entry into the optical interconnect market with the introduction of the HD-Optyx optical connector. The ...
SANTA CLARA, Calif., Sept. 20, 2024 /PRNewswire/ -- ECOC 2024 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will showcase its industry-leading ...
Celestial AI Inc., a startup developing optical chip technology to speed up artificial intelligence models, today announced that it has raised $100 million in funding. The round included contributions ...
Unveils the industry’s first CW-WDM MSA-compliant 16-wavelength light source; highlights ecosystem partner technologies enabling AI of the future “The explosive growth of AI models is breaking the ...
Portland, Ore. – IBM Corp. will team with Agilent Technologies Inc. to pursue “terabit per second optical interconnect” technology for multiprocessing servers, under a four-year, $30 million contract ...
Marvell is buying XConn to strengthen its PCIe, CXL, and UALink switching capabilities, and shore up its position as the ...
DARPA, Intel, and Ayar Labs collaborate on developing 100-Tb/s-plus in-package silicon photonic interfaces. Ayar’s TeraPHY chiplet combines silicon photonics and CMOS in a flip-chip SiP. Thermal ...
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