SAN JOSE, Calif. — Vertical Circuits Inc. has rolled out what the company calls a near through-silicon-via (TSV) die stacking technology. Vertical Circuits' technology, dubbed VIP (Vertical ...
The screens on today's electronic doodads come in all shapes, sizes, and resolutions, but they have one important thing in common: the red, blue, and green sub-pixels are arranged side-by-side. Even ...
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