AI-Driven Digital and Analog Flows, Multi-Die Innovations, and Broad IP Portfolio Deliver Unmatched Performance, Power and Area Advantages Among the newest collaborations is availability of certified ...
SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced ...
Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”), aimed at accelerating time to silicon for ...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...
Hsinchu, Taiwan, R.O.C. – April 15, 2008 – Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) today announced that it has signed an exclusive agreement with Blaze DFM, Inc. to ...
SUNNYVALE, Calif., April 23, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC's most ...
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