Electronic Design

High-Density Applications Demand Precision Analog Devices in Tiny Packages

Traditionally, the packaged integrated circuit (IC) has been much larger than the IC itself because standard packages must also contain the lead-frame and bond wires. That wasn’t an issue for decades ...
Electronic Design

High-Density Switching For Automotive Applications

With all the electronic subsystems packed into today’s vehicles, testing can be tricky. Here are some switch-system design techniques to help avoid testing pitfalls. The sophistication of today’s ...
Business Wire

Footprint Compatible Packaged GaN Family Expands to 150 V for Flexible Design of High-Power Density Applications

Efficient Power Conversion (EPC) introduces the 150 V, 6 mΩ EPC2308 GaN FET, offering higher performance and smaller solution size for high power density applications including DC-DC conversion, AC/DC ...
EDN

Low-density NOR flash for product longevity in embedded applications

Small standalone and embedded systems — think garage door openers, electric drills, manufacturing line equipment, and medical analysis systems — typically contain an 8-bit or 16-bit microcontroller ...
EDN

Half-bridge topology finds applications in high density power converters

Due to the ever increasing demands to drive up DC-DC power converter density, topologies that had previously been used only in high power applications are now finding their way into medium and lower ...
Business Wire

Panduit Expands Industry-Leading Network Cabling Solution for High Density Applications

TINLEY PARK, Ill.--(BUSINESS WIRE)--Panduit Corp., the leading global provider of small diameter 28-AWG cabling solutions, has added UTP and Shielded Category 6A performance patch cords to its 28-AWG ...