China’s microelectromechanical systems (MEMS) sensor industry is surging, but technical gaps, fragmented production and coordination challenges hinder its full potential. As global demand accelerates, ...
Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...
Abstract: Accurately and efficiently solving the physical characteristics of electromagnetic railguns is essential for understanding their dynamic behavior and ensuring reliable design. However, an ...
ABSTRACT: This paper is devoted to the study of frequency effects on hardness profile of AISI 4340 spline shaft heat-treated by induction through an extensive 3D finite element method simulation and ...
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