Abstract: This paper describes a three-layer wafer-level package (WLP) scheme with lateral feedthrough signals and double-sided symmetrical out-plane electrodes for 3D MEMS devices. The WLP usually ...
Abstract: In this study, a half-bridge electrical configuration of GaN package, including two GaN chips and two Si chips, were integrated into a 6mmx7mm package using fan-out panel level process. Cu ...
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