The move from planar SoCs to advanced packages can improve performance and provide flexibility in large designs, which are difficult to fit onto a single reticle-sized die. But ensuring the device ...

Three advanced nuclear developers—Radiant, Last Energy, and ARC Clean Technology—announced the closing of major private funding rounds in mid-December 2025, signaling renewed investor momentum behind ...

4.3B LinkedIn-Style Records Found in One of the Largest Data Exposures Ever Your email has been sent A massive, unsecured database containing billions of professional profiles has been left exposed ...

A new computational approach developed at the University of Chicago promises to shed light on some of the world's most puzzling materials—from high-temperature superconductors to solar cell ...

In a move with major implications for national security and the race to dominate artificial intelligence, President Trump announced Monday that he will allow Nvidia to sell its H200 computer chip — an ...

President Trump announced Monday that he will allow California-based Nvidia to sell its advanced H200 computer chips to "approved customers" in China, a boost to the semiconductor giant whose chips ...

Chair in the History of Finance and Associate Pro-Vice-Chancellor Research, Prosperity and Resilience, Henley Business School, University of Reading Adrian R Bell receives funding from UKRI via AHRC.

My second grader’s public school is full of warm, caring educators and decent support for students working below grade level. His class is big and rowdy, with a single teacher and a majority of kids ...

MARIETTA , Ga. — The Marietta History Center has launched a new online collections database, making thousands of artifacts, photographs and archival treasures accessible to the public from anywhere in ...

Advanced Paste can now perform tasks using local AI models instead of connecting to the cloud. Advanced Paste can now perform tasks using local AI models instead of connecting to the cloud. is a news ...

The semiconductor industry is undergoing a profound transformation. What once centered on single-die silicon packaged in QFN or BGA formats has evolved into a landscape of multi-die integration, ...