"Sushi-rolled" fiber chips are turning ordinary clothing into powerful, durable computers capable of image recognition and ...
ZHUHAI, GUANGDONG, CHINA, January 21, 2026 /EINPresswire.com/ -- Environmental responsibility has transitioned from ...
Robots are getting better at sniffing out smells thanks to improvements in electronic noses (e-noses). A comprehensive review ...
Molecular electronic devices built with atomic-level precision could shatter today’s limits on chip density, packing up to 1,000 times more components.
A newly published Taiwanese patent describes a powderless metal additive manufacturing concept using a TFT backplane to electrochemically print metal.
And while the technology sounds impressive now, it seems to be at the limits of what current laboratory photolithography can provide. At present, a 1 mm fibre chip can potentially integrate tens of ...
The EPC2366 40 V eGaN® FET sets new benchmarks in performance, efficiency, and power density for next-generation power ...
Traditional chips depend on flat, inflexible wafers; the Fudan team replaced these with elastic substrates capable of hosting resistors, capacitors, diodes, and transistors. Once patterned, each ...
From computers to smartphones, from smart appliances to the internet itself, the technology we use every day only exists ...
Quantum technology has reached a turning point, echoing the early days of modern computing. Researchers say functional ...
The 2D devices fabricated using CDimension’s ultra-thin films have demonstrated up to a 1,000X improvement in ...
A nanostructure made of silver and an atomically thin semiconductor layer can be turned into an ultrafast switching mirror ...
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